Overview

Thinning and polishing is one of the key technologies in the semiconductor manufacturing process, mainly used to reduce the thickness of the wafer in order to achieve higher performance chip manufacturing in subsequent process steps.

It occupies an important technical field in semiconductor manufacturing and has the following impacts:

  • Reduce wafer thickness: Wafer thickness determines the size and characteristics of transistors. Through thinning and polishing technology, the thickness of the wafer can be made to the precise value required, and the consistency and stability of the chip manufacturing process can be ensured.
  • Improve transistor performance: As the wafer thickness decreases, the electrical properties of the transistor can be improved, including lower resistance and higher operating frequency. This is very important for improving the performance and efficiency of integrated circuits.
  • Thinning and lightweight chips: Thinning and polishing technology can also reduce the consumption of silicon materials in the chip manufacturing process, thereby achieving thinning and lightweight chips. This is very beneficial for portable electronic devices such as wearable devices and mobile phones.
  • Reduce costs: Through thinning and polishing technology, the use of precious semiconductor materials can be reduced, reducing the cost of the manufacturing process. This is of great significance in large-scale production and increasing production capacity.

About Semiware


Semiware has a comprehensive product lineup of circuit protection device products. The company leverages its technology in the semiconductor field and application background in end products to serve customers in the electronics, automotive and industrial markets. For more information, please visit semiware official website: https://semiware.com/en/

Contact us

Email: cassie@semiware.com;
Tel: +86-18930674110;
Whatsapp: 008618123742225